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Introduction

At IBM Research, we are the innovation engine of IBM. Exploring what’s next in computing and shaping the technologies the world will rely on tomorrow. From advancing AI and hybrid cloud to pioneering practical quantum computing, we anticipate challenges and unlock new opportunities for clients, partners, and society. Working in Research means joining a team that accelerates discovery at the intersection of high-performance computing, AI, quantum, and cloud. You’ll collaborate with leading scientists, engineers, and visionaries to push boundaries and turn ideas into reality. With a culture built on curiosity, creativity, and collaboration, IBM Research offers the opportunity to grow your career while contributing to breakthroughs that transform industries and change the world.

Your role and responsibilities

We are seeking an experienced Semiconductor Unit Process Packaging Engineer with strong expertise in wets and lithography coat and develop processes. In this role, you will collaborate closely with engineers and scientists to support a wide range of applications, including packaging cleans, resist strip processes, and liftoff techniques. Candidates should be adept at troubleshooting complex issues, performing root‑cause analysis, and driving technology transfer activities. They are also expected to collaborate extensively with equipment and materials suppliers.

You will work as part of a cross‑site team spanning the IBM Microelectronics Research Lab (MRL) and Albany Nanotech Center (ANT). These facilities deliver world‑class 200mm and 300mm wafer‑scale fabrication and packaging capabilities for clients across Semiconductor Development, Quantum Computing, Artificial Intelligence, and government programs. The Packaging Engineer will work with the IBM Hardware team based in Yorktown Heights, NY to build and ramp up a new lab on the IBM campus in Poughkeepsie, NY. The position will initially be based in Yorktown with occasional travel to Poughkeepsie but will transition over the first two years to being in Poughkeepsie, with occasional travel to Yorktown.

Key requirements include hands‑on experience with semiconductor and packaging wets and lithography processes, the ability to quickly qualify new processes and tools, and proficiency with statistical process control (SPC) for robust operations. You will be expected to design and execute experiments for continuous improvement, drive process and tool enhancements through inspection and metrology, and help achieve tighter quality distributions, higher throughput, and improved yield. You will assume tool ownership responsibilities across multiple modules.

Strong organizational, communication, and presentation skills are essential, along with the ability to collaborate effectively across multifunctional teams.

Required education

Bachelor's Degree

Preferred education

Master's Degree

Required technical and professional expertise

• Strong familiarity with semiconductor and packaging wet processes and lithography is essential.
• The role requires the ability to quickly qualify new processes and packaging tools, apply statistical process control for stable operation, and design and execute experiments for ongoing optimization.
• Success also includes driving continuous improvements through inspection and metrology to achieve tighter quality distributions, higher throughput, and improved yield.
• Proven experience as semiconductor or packaging tool owner.
• Demonstrated capability to deliver successful technology transfer.

Preferred technical and professional experience

• Requires knowledge of semiconductor and packaging processes, including wets and lithography.
• Experience in metallization.
• Excellent organizational, communication, and presentation skills are critical for effective collaboration with cross‑functional teams and for interfacing with equipment and materials suppliers.