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Research Hardware Developer (Advisory professional)
IBM
Software Engineering, Other Engineering
Albany, NY, USA
Posted on Dec 12, 2024
Introduction
As a Hardware Developer at IBM, you’ll get to work on the systems that are driving the quantum revolution and the AI era. Join an elite team of engineering professionals who enable IBM customers to make better decisions quicker on the most trusted hardware platform in today’s market.
Your Role and Responsibilities
As a Hardware Developer at IBM, you’ll get to work on the systems that are driving the quantum revolution and the AI era. Join an elite team of engineering professionals who enable IBM customers to make better decisions quicker on the most trusted hardware platform in today’s market.
Your Role and Responsibilities
IBM’s Research Division is looking for an experienced bonding & assembly engineer with knowledge on wafer-level molding, laminate, reliability, and failure analysis to support the chiplet and advanced packaging initiatives for IBM Semiconductors in Albany, New York.
The engineer would be part of a multi-disciplinary, multi-cultural, research and development center that brings together advanced logic technologies nodes with next generation semiconductor packaging technologies.
The engineer would be part of a multi-disciplinary, multi-cultural, research and development center that brings together advanced logic technologies nodes with next generation semiconductor packaging technologies.
Required Technical and Professional Expertise
1) More than 5 years experience with 3D flip chip assembly, reliability testing, and failure analysis,
2) Basic understanding of wafer level packaging/assembly processes, laminate, reliability test, and tools ,
3) Ability to drive joint development with tooling/material supplier,
4) Positive and self-motivated and excellent presentation skills,
5) Ability to work in a team environment and to debug errors and solve problems.
2) Basic understanding of wafer level packaging/assembly processes, laminate, reliability test, and tools ,
3) Ability to drive joint development with tooling/material supplier,
4) Positive and self-motivated and excellent presentation skills,
5) Ability to work in a team environment and to debug errors and solve problems.
Preferred Technical and Professional Expertise
1) Hands on experience in semiconductor 3D packaging technology,
2) More than 5 years experience of flip chip assembly process (TCB, reflow), laminate technology, packaging reliability test, failure analysis, and semiconductor process,
3) Experience w/ design of experiments, process controls, and statistical data analysis,
2) More than 5 years experience of flip chip assembly process (TCB, reflow), laminate technology, packaging reliability test, failure analysis, and semiconductor process,
3) Experience w/ design of experiments, process controls, and statistical data analysis,