Find your next role
Discover amazing opportunities across our network of companies committed to gender equality in the workplace.
Lead Physical Design Engineer, Amazon Leo
Amazon
Design
Austin, TX, USA
Posted on Mar 28, 2026
Description
Amazon Leo is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to unserved and underserved communities around the world.
Lead physical design activities for the Modem SOC. Interface and select 3rd party physical design vendor. Manage execution of physical design work. Close the feedback loop with RTL team based on physical design considerations. Implement complex designs in the targeted technology node.
Key job responsibilities
Work closely with Architects, and RTL Designers to facilitate PPA analysis for technology node selection.
Review and analyze technology specific 3rd party IP blocks for performance, supported collateral, and other KPI
Review and analyze current and future 3rd party physical design teams to ensure high quality partnership.
Review and analyze DFT coverage to ensure project and product requirements are met.
Work closely with Architects and Designers to identify performance limits and improvements.
Interface with the current 3rd party physical design team. Audit and improve existing checklists and flows.
Build world class physical design capability through mentoring and hiring. This team will be capable of taking a design through floorplanning all the way to chip finishing.
Export Control Requirement:
Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.
A day in the life
Be part of Amazon LEO’s sub-team responsible for defining and implementing the digital chip SOCs for communications via Low Earth Orbit satellites and Amazon gateways. This is a unique opportunity to define the highest quality wireless solution with few legacy constraints. The team works with customer requirements and wireless system teams to define modems, high-speed interfaces, embedded processors, and DSP solutions in latest CMOS generation technologies.