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Description

Annapurna Labs is looking for a Packaging Engineer. As a member of the team, you will join a group of hardworking engineers to design and implement innovative next generation machine learning chips and servers. In this position, you will make a real impact in a dynamic, technology focused team. Your work will impact the growing field of machine learning.

You will collaborate with architects, design teams, software engineers to deliver the next generation ML chip. In this position, you will have the opportunity to be responsible for IP integration, 2.5D design, bring up, Characterization and validation.

Key job responsibilities
* Evaluation of packaging and assembly technology roadmap aligned to Annapurna product roadmap
* Engage with product architect and design teams on future products package and assembly needs
* Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurna’s products
* Engage with substrate and assembly vendors on future technologies roadmap

Product development and manufacturing:

* Define the substrate and package BOM of the ICs in collaboration with Package Design team and OSATs
* Assume full ownership of mechanical and thermal performance of Annapurna ICs
* In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.
* Ensure testability of the ICs in collaboration with Test Engineer team
* Work with Assembly, Test and Logistics to define work flows at OSATs (focus on Fab/assembly/test interfaces)
* Track assembly and substrate yields and look for ways to improve them